01 / SAPPHIRE
Sapphire
Sapphire ingots, substrates, polished wafers and 310 × 310 mm sheets for LED substrates and optical windows.
Purity> 5N
Thickness700 / 1,000 μm
Tolerance±3 μm
Sapphire · Silicon carbide · Yantai, China
Precision Slicing of Semiconductor Materials — Reliable Substrates for Advanced Manufacturing.
Yantai Likai Semiconductor Technology Co., Ltd. specializes in precision slicing and wafer processing of semiconductor materials, including sapphire, silicon carbide, monocrystalline silicon, fused quartz and alumina ceramics. With fully in-house capabilities spanning crystal growth, slicing, lapping, polishing and inspection, every piece is inspected before shipment, delivering high-precision, high-reliability substrates and wafers to customers worldwide.
Product range
All specifications
Five material systems, one fully integrated in-house line
The portfolio covers five major material families: sapphire, silicon carbide, monocrystalline silicon, fused quartz and alumina ceramics. From crystal growth, precision slicing, lapping and polishing to inspection and packaging, every step is performed in the same facility, enabling closed-loop quality control from material to finished product.
01 / SAPPHIRE
02 / SILICON CARBIDE
Silicon carbide
SiC substrates in 6 and 8 inch: n-type for power devices, semi-insulating for RF and HEMT.
Diameter6 in / 8 in
Thickness350 / 500 μm
GradeN-type · semi-insulating
03 / SILICON
Monocrystalline silicon
Prime and test-grade silicon wafers for device development, carrier plates and process trials.
Diameter6 in / 8 in / 12 in
Thickness200–1,000 μm
Orientation<100> · <111>
04 / FUSED QUARTZ
Fused quartz
JGS1 / JGS2 / JGS3 fused quartz slides, windows and discs where transmission matters most.
GradeJGS1 / JGS2 / JGS3
Thickness0.5–20 mm
Tolerance±0.05 mm
05 / ALUMINA CERAMIC
Alumina ceramics
95 % and 99 % alumina substrates and wear parts, sliced and lapped to the thickness on your drawing.
Purity95 % / 99 %
Thickness0.25–10 mm
Flatness≤ 0.02 mm
Custom slicing
Beyond standard products, the company accepts custom slicing of GaAs, GaN, glass, piezoelectric ceramics and non-standard geometries. Provide drawings and target tolerances for evaluation; new materials can be validated by sample slicing before mass production.
Send a drawing
Nine controlled steps from crystal to finished wafer
Quality control
Nine tightly controlled steps, piece by piece
Leveraging advanced processes such as multi-wire diamond slicing, every product passes through nine controlled steps: crystal growth, head/tail cropping, OD grinding, orientation inspection, multi-wire slicing, lapping, beveling, polishing, and final inspection & packaging. Quality records are kept at every step to ensure consistent thickness, flatness and surface quality.
01
Crystal growth
Kyropoulos for sapphire, PVT for silicon carbide — defect levels are set here.
02
Head / tail cropping
Diamond saw removes the ends and shoulders; the usable body is logged with an ID.
03
OD grinding
Outer diameter ground to nominal, reference flat or notch cut in the same setup.
04
Orientation inspection
X-ray diffraction confirms the C-plane or the <100> face before any cut.
05
Multi-wire slicing
Diamond wire cuts the whole boule in one pass; tension and feed set kerf and damage.
06
Lapping
Both faces lapped flat to remove saw damage and bring thickness into range.
07
Beveling
Edges rounded to prevent handling chips, profile held within the drawing tolerance.
08
Polishing
Double-side chemical-mechanical polishing to final thickness and roughness.
09
Inspection & packaging
Thickness, TTV, flatness, roughness and transmission measured piece by piece, then packed in a cleanroom.
Tolerances
Precise crystallographic orientation; every piece inspected before shipment
Crystallographic orientation is verified by X-ray diffraction before slicing to eliminate orientation errors. Finished products are inspected piece by piece for thickness, TTV, flatness, roughness and transmittance, with data archived by batch number. Wafers are double-layer packaged under controlled clean-room conditions, with a certificate of conformance and inspection report enclosed.
±0.2 mm
Dimension tolerance, 310 × 310 sheet
±3 μm
Thickness tolerance, 700 / 1,000 μm
<0.3 μm
Ra surface roughness after polish
0 %
Pieces inspected before shipment
Orientation by X-ray
C-axis offcut and reference flat are verified on every ingot before slicing.
Measured, then packed
Thickness, TTV, flatness, roughness and transmission are recorded against the batch number.
Cleanroom packing
Double-bagged in a controlled area, with a certificate of conformance in the box.
Applications
All applications
Broad applications across mainstream semiconductor sectors
Our products serve LED & optoelectronics, power electronics, consumer electronics & wearables, and optics & ceramics, providing downstream customers with stable, reliable substrates and wafers.
LED & optoelectronics
Patterned sapphire substrates and C-plane wafers.
PSS substratesC-plane2–6 in
Power electronics
SiC substrates for MOSFETs and Schottky diodes.
6 in / 8 inN-typeSemi-insulating / HEMT
Consumer & wearable
Sapphire covers for watch crystals, camera lenses and fingerprint sensors.
CoversWindowsThinned
Optics & ceramics
Quartz windows and alumina ceramic parts for instruments.
JGS gradesAluminaCustom
About LiKai
Yantai Likai Semiconductor Technology Co., Ltd.
Yantai Likai Semiconductor Technology Co., Ltd. ("Likai Semiconductor") is a wholly owned subsidiary of Yantai Likai CNC Technology Co., Ltd. ("Likai Technology"), extending the group's cutting technology into semiconductor materials.
Specializing in precision slicing of semiconductor materials, the company covers sapphire, silicon carbide, monocrystalline silicon, quartz glass and alumina ceramics, and also offers customized slicing of gallium arsenide and gallium nitride. Its complete in-house line — from crystal growth through slicing, lapping, polishing and inspection — runs nine controlled processes. Backed by diamond-wire multi-wire cutting and X-ray crystal-orientation inspection, it achieves sapphire thickness tolerance ±3 μm and surface roughness Ra ≤ 0.3 μm, with every piece inspected and data archived by batch number. Products serve LED and optoelectronics, power electronics, consumer electronics, optics and ceramics, as the company works to become a professional service provider in precision slicing of semiconductor materials worldwide.
Yantai Likai Numerical Control Technology Co., Ltd.
2018, Yantai → Likai Technology · National “Little Giant” Enterprise
Yantai Likai Numerical Control Technology Co., Ltd. ("Likai Technology"), established in June 2018, is a high-tech enterprise covering the entire cutting technology industry chain — equipment, diamond wire and multi-wire cutting services. It is a national "Little Giant" enterprise specializing in niche and innovative products, a "Double Soft" certified enterprise, and an industrial enterprise intellectual property application pilot enterprise recognized by China's Ministry of Industry and Information Technology, specializing in the R&D, production and sales of hard and brittle material cutting equipment.
The company holds ISO 9001, ISO 14001, ISO 45001 and GB/T 29490 management system certifications, as well as EU CE and UL certification. Its core products include multi-wire cutting equipment, laser cutting equipment and chamfering equipment, which are widely used in advanced hard and brittle materials such as metal materials, sapphire and semiconductor materials. These products are exported to more than ten countries and regions, including the United States, Japan, South Korea, the United Kingdom, Singapore, Brazil and India, providing comprehensive support in equipment, processes and R&D for Likai Semiconductor.
Facilities
A fully integrated in-house line, from crystal growth to inspection
Crystal growth, slicing, lapping, polishing and inspection are all performed at the same facility in Yantai, ensuring efficient process flow and closed-loop quality control, with full traceability of quality records at every stage.
Send us your drawing or your target specs.
Send the material, dimensions, thickness and quantity; we reply with a feasible specification and a lead time — and say so plainly when it is out of range.